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光学相干层析成像
1、光电参数 (TSLED = 20°C)
Parameter | Symbol | Cond. | Min | Typ | Max | Unit |
Operating Current | Iop | 500 | mA | |||
Power in SMF | Po | Iop,max | 15 | 20 | mW | |
Center Wavelength | λc | Iop,max | 1530 | 1550 | 1570 | nm |
Bandwidth FWHM | Iop,max | 50 | 60 | nm | ||
Spectral ripple[RB=0.1nm] | Iop,max | 0.2 | 0.4 | dB | ||
Monitor PD Current | IMPD | Iop,max | 100 | μA | ||
Monitor PD bias voltage | 0 | -12 | V |
2、参数极值
超过最大额定值的参数可能会对设备造成永久性损坏。长时间工作绝对最大额定条件下可能会影响设备的可靠性。
Parameters | Symbol | Cond. | Min | Max | Unit |
Forward current | IF | 550 | mA | ||
Reverse voltage | VR | -2 | V | ||
Forward voltage | VF | IF,max | 2 | V | |
Storage temperature | Tstg | -40 | 85 | ℃ | |
Operating temperature | Top | IF,max | -20 | 65 | ℃ |
Storage humidity | <30<>℃ >30℃ | 5
| 95 85 | %RH | |
Thermoelectric cooler voltage | Vtec | ** | 4.0 | V | |
Thermoelectic cooler current | Itec | ** | 1.8 | A | |
Thermistor Resistance | Rth | 20℃ | 12.5 | kΩ | |
Thermistor constant | B | 3892 | K | ||
Lead soldering Temperature | 260 | ℃ | |||
Lead soldering duration | 10 | s | |||
ESD | Human b.m | 500 | V | ||
**50度外界环境下测试值
