欢迎访问华瑞高光子科技(佛山)有限公司网站

在线聊天 marketing@hirundo-link.com 0757-26619220
EN

芯片切割方案

Hirundo have ultra-short pulse width laser equipment for diffrent materials cutting
image.png
FWDM,CWDM ,MWDM,LWDM,DWDM filters cutting
image.png
CWDM4 ,LWDM4 and LWDM8 AWG chips cutting
image.png
PLC wafer cutting
image.png
DWDM AWG wafer cutting
image.png

Special-shaped ceramic cutting
image.png
Cutting and chamfering of various glass materials
image.pngimage.png

上一篇:N/A

下一篇:4G/5G基站